PCB gold plate and PCB gilt plate are commonly used in circuit board production nowadays.

With the increasing integration of IC, the more and more IC pins are, However, the vertical Sn process is difficult to flatten the pads, which brings difficulty to the assembly of SMT, and the service life of the tin plate is very short. The PCB gold plated panels solve these problems. For the surface mount technology, especially for the super small surface paste, the plate evenness is directly related to the quality of the solder paste printing process, and it has a decisive influence on the quality of the back reflow welding. Therefore, the gilding of the circuit board is often seen in the high density and ultra small surface bonding process. In the trial stage, the influence of element procurement is often not the plate to weld, but often to wait a few weeks or even a month to use, the circuit board gild plate longer than a tin plate longer than the longer. So you are willing to use it. Besides, the cost of gold plating stage is almost the same as that of tin lead alloy plate.

What is gilt

Gilding refers to the distinction between electroplated gold, nickel plated gold plating, electrolytic gold, electric gold, nickel plated gold plate, soft gold and hard gold (commonly used as gold fingers). The principle is that nickel and gold (commonly known as gold salt) are dissolved in chemical water, and the circuit board is immersed in the electroplating cylinder and through the current to produce nickel gold coating on the copper foil surface of the circuit board. The electric nickel gold is widely used in electronic product name because of its high hardness, wear resistance and difficult oxidation.

What is gold sinking

Gold deposit is a layer of coating by chemical redox reaction, which is usually thick and is a kind of chemical nickel gold layer deposition method, which can reach a thick gold layer, usually called gold deposit.

The difference between gold plate and gilded plate

First, the deposit of the circuit board is different from the crystal structure formed by the plating of the circuit board. The thickness of gold for gold is much thicker than the gold plating. The gold will be yellow and the gold plating is more yellow than the gold plating, and the customer is more satisfied.

Two, sinking gold is easier to weld than gold plating, which will not cause bad welding and cause customer complaints. The stress of the sunk plate is easier to control, and it is more advantageous to the processing of fixed products for the products with definite state. At the same time, it is also because the gold sink is more soft than the gold plated, so the sunk board makes the gold finger not wearable.

Three, the gold plate only has nickel gold on the pad. The signal transmission in the skin effect is not affected by the copper layer.

Four, gold deposition is more compact than gold plating, and it is not easy to produce oxidation. Make technological choices according to their demand for products.

Five, as wiring becomes more and more dense, the width and spacing have reached 3-4MIL. Gold plating makes gold wire short circuited. The gold plate only has nickel gold on the pad, so the gold wire will not be short circuited.

Six, the PCB gold plate only has nickel gold on the pad, so the resistance welding on the line is more firmly combined with the copper layer. The engineering will not affect the spacing when it is compensated.

Seven, generally used for relatively high requirements of the board, flatness is better, usually using circuit boards to sink gold, sunk gold generally does not appear after assembly of black pad phenomenon. The flatness and life expectancy of the sunk plate are as good as that of the gold plated board.